Advanced Design and Manufacturing of Stent-grafts for the Treatment of Aortic Diseases

Prof Fangsen Cui

Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), Singapore

Abstract: Endovascular stent-graft repair is a minimally invasive treatment for aortic diseases, yet current devices face limitations in curved anatomical regions like the aortic arch—where device maladaptation can lead to complications such as endoleaks, migration, or structural collapse. To address these challenges, we present a novel metamaterial-based stent-graft designed for enhanced conformability in complex geometries. Leveraging patient-specific 3D printing, we manufactured this next-generation device and hypothesize it will enable safer, more effective total endovascular arch repair with reduced complication rates. This work highlights the sustainable and resilient development of the stent-graft, focusing on its metamaterial design and additive manufacturing process. Our results demonstrate a simple, effective, and fully endovascular solution for aortic arch pathologies, bridging a critical gap in vascular intervention technology

Bio: Dr. Fangsen Cui is a Senior Principal Scientist at the Institute of High Performance Computing (IHPC), A*STAR, Singapore. He holds a B.S. (1984) and M.Eng. (1989) from Xi’an Jiaotong University and a Ph.D. from the National University of Singapore (2001). His research spans mechanics, acoustics, and biomechanics, with a focus on computational and applied mechanics. 

Dr Cui was the recipient of the International Computational Investigator Award in 2019, the IES Prestigious Engineering Achievement Award in 2021, and the Singapore Long Service Medal in 2024. Fangsen is active in both academic and society activities: He is the co-editor or in the editorial board for a few journals. He is the General Council Member of International Association for Computational Mechanics (IACM, from 2012), Executive Council Member of Asia-Pacific Association for Computational Mechanics (APACM, from 2018), Fellow of International Association of Applied Mechanics (IAAM 2020), Standing Executive Board Member of the International Society of Mechanical System Dynamics (ISMSD 2023), and the President of SACM from 2017.